Cross-section observation service - List of Manufacturers, Suppliers, Companies and Products

Cross-section observation service Product List

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Cross-section polishing (CP) method for cross-sectional observation service.

Achieves high processing accuracy and a wide processing area! Machining is also possible while reducing damage with cooling functions.

The CP method allows for the observation of cross-sections without damage from polishing, compared to mechanical polishing methods. Our triple ion milling device with cooling function achieves high processing precision and a wide processing area through ion beams irradiated from three directions. For materials sensitive to heat, processing can be done while reducing damage with the cooling function. 【Features】 - Processing width of approximately 4mm and processing depth of approximately 1mm, allowing for extensive processing. - High flatness in both hard and soft materials, enabling the production of cross-sections without physical damage. - Capable of producing cross-sections with good positional accuracy. - Processing can be done while cooling (cryogenic). *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment
  • Analysis and prediction system

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Surface mount electronic component cross-sectional observation service

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

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